

Author: O’Sullivan Gerry Li Bowen Dunne Padraig Hayden Paddy Kilbane Deirdre Lokasani Ragava Long Elaine Ohashi Hayato O’Reilly Fergal Sheil John Sheridan Paul Sokell Emma Suzuki Chihiro White Elgiva Higashiguchi Takeshi
Publisher: IOP Publishing
E-ISSN: 1402-4896|90|5|54002-54009
ISSN: 1402-4896
Source: Physica Scripta, Vol.90, Iss.5, 2015-05, pp. : 54002-54009
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Abstract
Lithography tools are being built and shipped to semiconductor manufacturers for high volume manufacturing using extreme ultraviolet lithography (EUVL) at a wavelength of 13.5 nm. This wavelength is based on the availability of Mo/Si multilayer mirrors (MLMs) with a reflectivity of ∼70% at this wavelength. Moreover, the primary lithography tool manufacturer, ASML, has identified 6.
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