Rapid Low‐Temperature 3D Integration of Silicon Nanowires on Flexible Substrates

Publisher: John Wiley & Sons Inc

E-ISSN: 1613-6829|11|32|3995-4001

ISSN: 1613-6810

Source: SMALL, Vol.11, Iss.32, 2015-08, pp. : 3995-4001

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract