An In Situ Experimental‐Numerical Approach for Characterization and Prediction of Interface Delamination: Application to CuLF‐MCE Systems

Publisher： John Wiley & Sons Inc

E-ISSN： 1527-2648|14|11|1034-1041

ISSN： 1438-1656

Source： ADVANCED ENGINEERING MATERIALS (ELECTRONIC), Vol.14, Iss.11, 2012-11, pp. : 1034-1041

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