Thermal stability of submicrocrystalline copper strengthened with HfO₂ nanoparticles in the temperature range 20–500 °C

Author： Lebedev A. Pul’nev S. Vetrov V. Burenkov Yu. Kopylov V. Betekhtin K.

ISSN： 1063-7834

Source： Physics of the Solid State, Vol.40, Iss.7, 1998-07, pp. : 1155-1157

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