The worst ill-conditioned silicon wafer slicing machine detected by using grey relational analysis

Author： Lin Chin-Tsai   Chang Che-Wei   Chen Chie-Bein  

Publisher： Springer Publishing Company

ISSN： 0268-3768

Source： The International Journal of Advanced Manufacturing Technology, Vol.31, Iss.3-4, 2006-11, pp. : 388-395

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