Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips

Author： Xiaoxian Liu   Zhangming Zhu   Yintang Yang   Fengjuan Wang   Ruixue Ding  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.35, Iss.1, 2014-01, pp. : 15008-15015

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Modeling of Thermally Induced Stresses in Three-Dimensional Bonded Integrated Circuit Wafers

By Zhang Jing  

Journal of Electronic Materials, Vol. 40, Iss. 5, 2011-05 ,pp. : 670-673

Springer Publishing Company

Access to resources Recommend Favorite

Analysis and optimization of TSV–TSV coupling in three-dimensional integrated circuits

By Yingbo Zhao   Gang Dong   Yintang Yang  

Journal of Semiconductors, Vol. 36, Iss. 4, 2015-04 ,pp. : 45011-45018

IOP Publishing

Access to resources Recommend Favorite

Design for Stability of High-Speed Integrated Photoreceivers: A Tutorial

By Boyoguéno André   Sawan Mohamad   Slamani Mustapha  

Analog Integrated Circuits and Signal Processing, Vol. 45, Iss. 1, 2005-10 ,pp. : 79-98

Springer Publishing Company

Access to resources Recommend Favorite

A Three-Dimensional Quantum Vacuum-Noise/Signal Beamsplitter Model for Nonideal Linear Optical Amplifiers

By desurvire E.  

Optical Fiber Technology, Vol. 5, Iss. 1, 1999-01 ,pp. : 82-91

Academic Press

Access to resources Recommend Favorite

To “A Three-Dimensional Quantum Vacuum-Noise/Signal Beamsplitter Model for Nonideal Linear Optical Amplifiers”

By desurvire E.  

Optical Fiber Technology, Vol. 6, Iss. 2, 2000-04 ,pp. : 199-211

Academic Press

Access to resources Recommend Favorite