Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Author： Gan C. Classe F. Chan B. Hashim U.

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.43, Iss.4, 2014-04, pp. : 1017-1025

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

By Xu Hui

Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 124-131

Springer Publishing Company

Access to resources Recommend Favorite

Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth

By Amistoso Jose

Journal of Electronic Materials, Vol. 39, Iss. 10, 2010-10 ,pp. : 2324-2331

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires

By Chuang Tung-Han

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3215-3222

Springer Publishing Company

Access to resources Recommend Favorite

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

By Kim Byoung-Joon

Journal of Electronic Materials, Vol. 39, Iss. 10, 2010-10 ,pp. : 2281-2285

Springer Publishing Company

Access to resources Recommend Favorite

The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

By Sigelko J. Choi S. Subramanian K. Lucas J.

Journal of Electronic Materials, Vol. 29, Iss. 11, 2000-11 ,pp. : 1307-1311

Springer Publishing Company

Access to resources Recommend Favorite