Wafer bonding using Cu–Sn intermetallic bonding layers

Author: Flötgen C.   Pawlak M.   Pabo E.   Wiel H.   Hayes G.   Dragoi V.  

Publisher: Springer Publishing Company

ISSN: 0946-7076

Source: Microsystem Technologies, Vol.20, Iss.4-5, 2014-04, pp. : 653-662

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