Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates

Author: Ramachandran Koushik   Ready W.   Raj P.   Sundaram Venky   Tummala Rao  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.25, Iss.4, 2014-04, pp. : 1687-1695

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