The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

Author： Zhang Keke   Zhang Xiaojiao   Qiu Ranfeng   Shi Hongxin   Liu Yujie  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.25, Iss.4, 2014-04, pp. : 1681-1686

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