Lapping assisted dissolved wafer process of silicon for MEMS structures

Author： Dutta Shankar   Kumar Manoj   Kumar Surender   Imran Md   Yadav Isha   Kumar Anand   Kumar P.   Pal Ramjay  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.25, Iss.4, 2014-04, pp. : 1984-1990

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

The Influence of Wafer Cleaning Process on the Silicon Surface Roughness

By  

Advanced Materials Research, Vol. 2015, Iss. 1109, 2015-07 ,pp. : 262-265

Trans Tech Publications

Access to resources Recommend Favorite

The Relation of Temperature Distribution on Silicon Wafer with Furnace Temperature and Gas Flow during Thermal Dry Oxidation Process

By  

Advanced Materials Research, Vol. 2015, Iss. 1109, 2015-07 ,pp. : 6-10

Trans Tech Publications

Access to resources Recommend Favorite

Study of polymer humidity sensor array on silicon wafer

By Wang Jing   Shi Kaihe   Chen Lihua   Zhang Xiaojun  

Journal of Materials Science, Vol. 39, Iss. 9, 2004-05 ,pp. : 3155-3157

Springer Publishing Company

Access to resources Recommend Favorite

Microdefects induced by cavitation for gettering in silicon wafer

By Macodiyo Dan   Soyama Hitoshi   Masakawa Takashi   Hayashi Kazuo  

Journal of Materials Science, Vol. 41, Iss. 16, 2006-08 ,pp. : 5380-5382

Springer Publishing Company

Access to resources Recommend Favorite

Modeling of fatigue in polysilicon MEMS structures

By Bhalerao K.   Soboyejo A. B. O.   Soboyejo W. O.  

Journal of Materials Science, Vol. 38, Iss. 20, 2003-10 ,pp. : 4157-4161

Springer Publishing Company

Access to resources Recommend Favorite