Future and technical considerations of gold wirebonding in semiconductor packaging - a technical review

Author： Gan Chong Leong Classe Francis Chan Bak Lee Hashim Uda

ISSN： 1356-5362

Source： Microelectronics International, Vol.31, Iss.2, 2014-04, pp. : 121-128

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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