Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling
Publisher: IOP Publishing
E-ISSN: 1361-6439|25|12|125016-125022
ISSN: 0960-1317
Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.12, 2015-12, pp. : 125016-125022
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Abstract