Gold metallizations for eutectic bonding of silicon wafers

Author： Lani S.   Bosseboeuf A.   Belier B.   Clerc C.   Gousset C.   Aubert J.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.12, Iss.10-11, 2006-09, pp. : 1021-1025

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