Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects

Author： Yin L.   Liu Z. H.   Yang Z. P.   Wang Z. L.   Shingubara S.  

Publisher： Maney Publishing

ISSN： 0020-2967

Source： Transactions of the Institute of Metal Finishing, Vol.88, Iss.3, 2010-05, pp. : 149-153

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