Effect of bonding parameters on microstructure development during TGTLP bonding of Al7075 alloy

Author： Afghahi S. Salman S.   Ekrami Aliakbar   Farahany Saeed   Jahangiri Amirreza  

Publisher： Taylor & Francis Ltd

ISSN： 1478-6443

Source： Philosophical Magazine, Vol.94, Iss.11, 2014-04, pp. : 1166-1176

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