Enrichment Efficiency Optimization of Dielectrophoresis Cell Chip Based on Interdigitated Microelectrodes Array

By  

Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. : 1255-1260

Trans Tech Publications

Access to resources Recommend Favorite

Dielectrophoresis Tweezers for Single Cell Manipulation Using Metal Coated Chemically Etched Fiber

By  

Key Engineering Materials, Vol. 2014, Iss. 625, 2014-10 ,pp. : 678-682

Trans Tech Publications

Access to resources Recommend Favorite

Stress Reduction of Solar Cell with Nanostructures on Silicon Chip Surface

By  

Key Engineering Materials, Vol. 2016, Iss. 723, 2017-02 ,pp. : 476-480

Trans Tech Publications

Access to resources Recommend Favorite

An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperature

By Liu De-Shin   Yeh Shu-Shen   Kao Chun-Teh   Huang Pay-Yau   Tsai Chia-I   Liu An-Hong   Ho Shu-Ching  

Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. : 31-41

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

By Nah J.-W.   Kim J.H.   Lee H.M.   Paik K.-W.  

Acta Materialia, Vol. 52, Iss. 1, 2004-01 ,pp. : 129-136

Elsevier

Access to resources Recommend Favorite