Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

Author： Nah J.-W.   Kim J.H.   Lee H.M.   Paik K.-W.  

Publisher： Elsevier

ISSN： 1359-6454

Source： Acta Materialia, Vol.52, Iss.1, 2004-01, pp. : 129-136

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