Development of Low Cost Sn-0.7Cu Base Composite Solder for High Temperature Application

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2014|803|239-242

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2014, Iss.803, 2015-01, pp. : 239-242

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract