Sic-Reinforced Aluminum-Silicon Composite via Pressureless Infiltration Using Polystyrene as External Binder for Electronic Assemblies

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2015|819|220-225

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2015, Iss.819, 2015-07, pp. : 220-225

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Abstract