Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

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Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 109-114

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Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling

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Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 97-102

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Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu Substrate

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Effect of Si₃N₄ Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy

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Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium

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Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 8-12

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