Thin-dielectric-layer engineering for 3D nanostructure integration using an innovative planarization approach

Author: Guerfi Y   Doucet J B   Larrieu G  

Publisher: IOP Publishing

E-ISSN: 1361-6528|26|42|425302-425308

ISSN: 0957-4484

Source: Nanotechnology, Vol.26, Iss.42, 2015-10, pp. : 425302-425308

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