The effect of plasma power on the properties of low‐temperature silicon nitride deposited by RPALD for a gate spacer
Publisher: John Wiley & Sons Inc
E-ISSN: 1862-6319|212|12|2785-2790
ISSN: 1862-6300
Source: PHYSICA STATUS SOLIDI (A) APPLICATIONS AND MATERIALS SCIENCE, Vol.212, Iss.12, 2015-12, pp. : 2785-2790
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Abstract