Publisher： John Wiley & Sons Inc
E-ISSN： 1527-2648|17|12|1876-1876
ISSN： 1438-1656
Source： ADVANCED ENGINEERING MATERIALS (ELECTRONIC), Vol.17, Iss.12, 2015-12, pp. : 1876-1876
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Abstract
The cover picture illustrates the possibility of creating hybrid materials with spiral inner architecture, while simultaneously producing a submicron scale structure. This is achieved by twist extrusion, which converts straight wires embedded in a billet to helical ones. More details can be found in the article by Y. Beygelzimer and co‐workers on page 1853
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