Effect of cooling rate on structure and creep behavior of Sn-0.7Cu-0.5Zn lead-free solder alloy

E-ISSN： 1286-0050|48|2|20902-20902

ISSN： 1286-0042

Source： EPJ Applied Physics (The), Vol.48, Iss.2, 2009-09, pp. : 20902-20902

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