Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Publisher: Edp Sciences

E-ISSN: 2261-236x|78|issue|01073-01073

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.78, Iss.issue, 2016-10, pp. : 01073-01073

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract