Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models

Author： Wong Terence K.S.  

Publisher： MDPI

E-ISSN： 1996-1944|5|9|1602-1625

ISSN： 1996-1944

Source： Materials, Vol.5, Iss.9, 2012-09, pp. : 1602-1625

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