Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

Author: Vianco Paul   Rejent Jerome   Grazier Mark   Kilgo Alice  

Publisher: MDPI

E-ISSN: 1996-1944|5|11|2151-2175

ISSN: 1996-1944

Source: Materials, Vol.5, Iss.11, 2012-11, pp. : 2151-2175

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract