Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Author: Li Xiao   Chan King Yuk   Ramer Rodica  

Publisher: MDPI

E-ISSN: 2072-666x|9|3|138-138

ISSN: 2072-666x

Source: Micromachines, Vol.9, Iss.3, 2018-03, pp. : 138-138

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