Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens

E-ISSN： 1662-9779|2018|273|83-90

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2018, Iss.273, 2018-06, pp. : 83-90

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance ‐ ANOVA

By Bukat K. Sitek J. Kisiel R. Moser Z. Gasior W. Koscielski M. Pstrus J.

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 9-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Tensile anisotropy in Cu-Ni-Mn-Sn-Al alloys

By Han Seungzeon Sohn Keunyong Kim Changjoo Kim Sangshik

Metallurgical and Materials Transactions A, Vol. 35, Iss. 2, 2004-02 ,pp. : 465-469

Springer Publishing Company

Access to resources Recommend Favorite

Tensile strength of thermomechanically processed Cu-9Ni-6Sn alloys

By Rhu Jae Kim Sang Jung Yun Han Seung Kim Chang

Metallurgical and Materials Transactions A, Vol. 30, Iss. 10, 1999-10 ,pp. : 2649-2657

Springer Publishing Company

Access to resources Recommend Favorite

The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong Sheng Mei Luo Le

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L. Perovic D. D. Rutter J. W.

Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. : 193-198

Maney Publishing

Access to resources Recommend Favorite