Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

Author： Yi Pan   Xiao Kui   Ding Kangkang   Dong Chaofang   Li Xiaogang  

Publisher： MDPI

E-ISSN： 1996-1944|10|2|137-137

ISSN： 1996-1944

Source： Materials, Vol.10, Iss.2, 2017-02, pp. : 137-137

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Approach to detecting latent defects of the printed circuit boards thin-filmed coatings

By  

MATEC Web of conference, Vol. 194, Iss. issue, 2018-08 ,pp. : 01006-01006

Edp Sciences

Access to resources Recommend Favorite

Modeling of the ecological separation process of printed circuit boards

By  

MATEC Web of conference, Vol. 210, Iss. issue, 2018-10 ,pp. : 01004-01004

Edp Sciences

Access to resources Recommend Favorite

Mechanical Fatigue Behavior of Flexible Printed Organic Thin-Film Transistors under Applied Strain

By Sekine Tomohito   Kumaki Daisuke   Tokito Shizuo  

Materials, Vol. 10, Iss. 1, 2016-12 ,pp. : 18-18

MDPI

Access to resources Recommend Favorite

Rock Wool and Printed Circuit Boards (PCBs) as Partial Fine Aggregate Replacements in Cement Mortar

By  

Key Engineering Materials, Vol. 2018, Iss. 775, 2018-09 ,pp. : 567-575

Trans Tech Publications

Access to resources Recommend Favorite

Corrosion Behavior of Silver-Plated Circuit Boards in a Simulated Marine Environment with Industrial Pollution

By Xiao Kui   Yi Pan   Yan Lidan   Bai Ziheng   Dong Chaofang   Dong Pengfei   Gao Xiong  

Materials, Vol. 10, Iss. 7, 2017-07 ,pp. : 762-762

MDPI

Access to resources Recommend Favorite