Effect of novel alkaline copper slurry on 300 mm copper global planarization

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Journal of Semiconductors, Vol. 35, Iss. 9, 2014-09 ,pp. : 96003-96006

IOP Publishing

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Stability for a novel low-pH alkaline slurry during the copper chemical mechanical planarization

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Journal of Semiconductors, Vol. 35, Iss. 8, 2014-08 ,pp. : 86001-86006

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A new weakly alkaline slurry for copper planarization at a reduced down pressure

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Journal of Semiconductors, Vol. 35, Iss. 2, 2014-02 ,pp. : 26005-26008

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Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

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Effect of three kinds of guanidinium salt on the properties of a novel low-abrasive alkaline slurry for barrier CMP

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