Redox Reactions at Cu,Ag/Ta2O5 Interfaces and the Effects of Ta2O5 Film Density on the Forming Process in Atomic Switch Structures

Publisher： John Wiley & Sons Inc

E-ISSN： 1616-3028|25|40|6374-6381

ISSN： 1616-301x

Source： ADVANCED FUNCTIONAL MATERIALS, Vol.25, Iss.40, 2015-10, pp. : 6374-6381

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