The Effect of Dipping Time to the Intermetallic Compound and Free Solder Thickness of Sn-Cu-Ni (SN100C) Lead-Free Solder Coating

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|754|493-497

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 493-497

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