The Effect of Dipping Time to the Intermetallic Compound and Free Solder Thickness of Sn-Cu-Ni (SN100C) Lead-Free Solder Coating

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Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 493-497

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Mechanical Properties and Solderability of Robust Sn-0.7Cu Lead-Free Composite Solder

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Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 556-560

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Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

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Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 489-492

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Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

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Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 166-170

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Physical and Mechanical Behaviors of SnCu-Based Lead-Free Solder Alloys with an Addition of Aluminium

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Applied Mechanics and Materials, Vol. 2015, Iss. 815, 2015-12 ,pp. : 64-68

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