A New Lead-Free Solder Joint Utilizing Superplastic Al-Zn Eutectoid Alloy for Next Generation SiC Power Semiconductor Devices

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2016|838|482-487

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2016, Iss.838, 2016-02, pp. : 482-487

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