De-tethering of high aspect ratio metallic and polymeric MEMS/NEMS parts for the direct pick-and-place assembly of 3D microsystem

Author： Colinjivadi Karthik

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.14, Iss.9-11, 2008-10, pp. : 1621-1626

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