Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won   Jung Seung-Boo  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

Springer Publishing Company

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Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

By Xiao H.  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 7, 2013-07 ,pp. : 2527-2536

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Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

By Shi X. Q.   Kwan H. F.   Nai S. M. L.   Lim G. H.  

Journal of Materials Science, Vol. 39, Iss. 3, 2004-02 ,pp. : 1095-1099

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

By Tseng Chien-Fu   Duh Jenq-Gong  

Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

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