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Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2039-2045

Elsevier

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High frequency wire bonding for PBGA package, a process optimisation approach

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Microelectronics International, Vol. 16, Iss. 3, 1999-12 ,pp. : 22-35

Emerald Group Publishing Ltd

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Optimal process parameters design for a wire bonding of ultra-thin CSP package based on hybrid methods of artificial intelligence

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Microelectronics International, Vol. 24, Iss. 3, 2007-07 ,pp. : 3-10

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Effects of chip scale package and flip-chip on the design and manufacturing of electronic products

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Microelectronics International, Vol. 15, Iss. 1, 1998-01 ,pp. : 35-38

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Effects of die-pad resonance on ultrasonic bond quality of wire bonds

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Microelectronics International, Vol. 24, Iss. 1, 2007-01 ,pp. : 23-26

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