Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

By Powers Mike  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 224-231

Springer Publishing Company

Access to resources Recommend Favorite

Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling

By Li J.  

Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 77-84

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints

By Chang Y.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2489-2494

Springer Publishing Company

Access to resources Recommend Favorite

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

By Maleki Milad   Cugnoni Joë   Botsis John  

Journal of Electronic Materials, Vol. 43, Iss. 4, 2014-04 ,pp. : 1026-1042

Springer Publishing Company

Access to resources Recommend Favorite

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 273-282

Springer Publishing Company

Access to resources Recommend Favorite