Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

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Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints: Enabling Life Predictions under Microstructural Uncertainty

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Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

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Journal of Electronic Materials, Vol. 43, Iss. 4, 2014-04 ,pp. : 1026-1042

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The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

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