Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

By Huang K.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2403-2411

Springer Publishing Company

Access to resources Recommend Favorite

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

By Wang Chao-hong  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2375-2381

Springer Publishing Company

Access to resources Recommend Favorite

Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects

By Huang M.  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 730-740

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- x Ni/Au/Ni Sandwich Structures

By Yu Chi-Yang  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2544-2552

Springer Publishing Company

Access to resources Recommend Favorite

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

By Chen Sinn-wen  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2418-2428

Springer Publishing Company

Access to resources Recommend Favorite