Author: Wu Weiwei Cheng Li Yuan Miaomiao Bai Suo Wei Zhiyang Jing Tao Qin Yong
Publisher: American Scientific Publishers
ISSN: 1947-2935
Source: Science of Advanced Materials, Vol.5, Iss.8, 2013-08, pp. : 933-938
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A New Reverse Engineering Method for the 3D Surface Reconstruction without Contact
Advanced Materials Research, Vol. 2015, Iss. 1099, 2015-05 ,pp. :
The Influence of Wafer Cleaning Process on the Silicon Surface Roughness
Advanced Materials Research, Vol. 2015, Iss. 1109, 2015-07 ,pp. :