Publisher: Elsevier
Founded in: 1988
Total resources: 4
ISSN: 0921-5107
Subject: TB1 engineering science
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Materials Science and Engineering: B
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Low K dielectrics in sintered Al-Zr oxide composites processed by thermal plasma heating
By Sahu D.R., Singh S.K., Choudhury R.N.P., Roul B.K. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.By Jawahar I.N., Sebastian M.T., Mohanan P. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.By Jiang N., Shen Y.G., Mai Y.-W., Chan T., Tung S.C. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow
By Sharif A., Chan Y.C. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.By Sharif A., Chan Y.C., Islam R.A. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.X-ray diffraction topography observations of the core in Bi 12 SiO 20 crystals doped with Mn
By Milenov T.I., Botev P.A., Rafailov P.M., Gospodinov M.M. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.Structure-property relationship in high-tension ceramic insulator fired at high temperature
By Islam R.A., Chan Y.C., Islam M.F. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.Many-body effects on the ground-state energy in semiconductor quantum wells
By Kim M.R., Tong C., Kim S.K., Son M.S., Shin D.H., Rhee J.K. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.Impact of microstructure on dielectric properties of Pb(Mg 1/3 Nb 2/3 )O 3 -PbTiO 3 thin films
By Laha A., Bhattacharyya S., Krupanidhi S.B. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.By Guruvenket S., Mohan Rao G. in (2004)
Materials Science and Engineering: B , Vol. 106, Iss. 2, 2004-01 , pp.