Low-temperature passivation of copper by doping with Al or Mg

Author: Lanford W.A.   Dingord i.   Wang W.   Hymes S.   Muraka S.P.   Ding P.J.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 234-241

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Abstract