About the origin and the mechanisms involved in the cracking of highly porous silicon layers under capillary stresses

Author： Belmont O. Faivre C. Bellet D. Brechet Y.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.276, Iss.1, 1996-04, pp. : 219-222

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