Effects of reaction kinetics on the microstructure of chemical vapour deposited copper films: Experiment and simulation

Author： Goswami J. Shivashankar S.A. Anathakrishna G.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.305, Iss.1, 1997-08, pp. : 52-60

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