Temperature dependence of the Al-fill processes for submicron-via structures

Author: Weber S.J.   Iggulden R.C.   Schnabel R.F.   Weigand P.   Restaino D.D.   Brodsky S.B.   Mehter E.A.   Clevenger L.A.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.320, Iss.1, 1998-05, pp. : 63-66

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Abstract