Assessment of post-CMP cleaning mechanisms using statistically-designed experiments

Author: Zhang G.   Burdick G.   Dai F.   Bibby T.   Beaudoin S.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.332, Iss.1, 1998-11, pp. : 379-384

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Abstract