Author: Yang G.-R. Zhao Y.-P. Hu Y.Z. Paul Chow T. Gutmann R.J.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.333, Iss.1, 1998-11, pp. : 219-223
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A micro-contact and wear model for chemical-mechanical polishing of silicon wafers
Wear, Vol. 252, Iss. 3, 2002-02 ,pp. :
By Komanduri R. Jiang M. Wood N.O.
Wear, Vol. 220, Iss. 1, 1998-09 ,pp. :
Wear phenomena in chemical mechanical polishing
By Liang H. Kaufman F. Sevilla R. Anjur S.
Wear, Vol. 211, Iss. 2, 1997-11 ,pp. :
Effect of electric field on chemical mechanical polishing of langasite
By Lim D.-S. Yoon I. Danyluk S.
Wear, Vol. 249, Iss. 5, 2001-06 ,pp. :